The symposium is organised by the European Space Agency’s Materials, Manufacturing, and Assembly section and EEE Components Technologies section, in partnership with IPC, the global electronics association. The event will focus on the latest developments in printed circuit boards, electronic assembly and packaging technologies. While space applications remain a core focus, the event also covers high-reliability market segments such as defence, automotive, medical and data infrastructure, which are central to Europe’s electronics manufacturing industry.
Status: announced
Pre-registation: requested
Who can attend: registered