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Materials & Electrical Components Laboratory

Materials & Electrical Components Laboratory

Made up of more than 20 dedicated experimental facilities and hundreds of instruments overall, the Materials & Electrical Components Laboratory guarantees an optimal choice of electrical components, materials and processes for ESA missions and external projects. The capabilities of the lab consider the unique environmental challenges involved in building for space, and, additionally, investigating failures to ensure that similar issues do not occur on future missions.

The laboratory enables testing, analysis and measurement of space materials and EEE components to determine their suitability for space flight applications, by evaluating the effects of the space environment. Here, all of the unique environmental challenges involved in building for space are considered and failures investigated, to ensure issues do not occur on future missions. The team routinely assesses EEE components and manufacturing processes, and characterises all physical and chemical properties of the involved materials. It verifies and qualifies their use and investigates the causes of failures, providing impartial and independent testing, expert knowledge. This is achieved using the unique equipment support service only made possible at ESA-ESTEC.

The laboratory, with its team of highly trained engineers, is ISO 9001 certified, and its Co-60 radiation facility is accredited to ISO/IEC 17025. Additionally, it serves as a certification authority for space materials and processes (M&P) in Europe.

The Materials and Electrical Components Laboratory invites projects from all backgrounds to conduct non-routine work using our confidential and impartial services and products.

Contact

For general enquires regarding this TEC location please refer to the assigned contacts:

Paavo Heiskanen

Radiation Hardness Assurance and Component Analysis Section

Riccardo Rampini

Materials Physics and Chemistry Section

Thomas Rohr

Materials and Processes Section

For testing requests, access to lab facilities, training and consultancy services, please refer to:

THIRD PARTY ACTIVITIES

TPA Management system

Request

Optimal choice of electrical components, materials and processes for ESA missions and external projects

Expertise for performing test, analysis and measurement of space materials

Electronic component analysis. Credit: Remedia

Preparing for optical characterization of space materials in the Yuta facility. Credit: Remedia

Fine and Gross leak testing of electronic components. Credit: Remedia

Fatigue characterisation of materials. Credit: Remedia

1. ENVIRONMENTAL TEST LABORATORY

Contact: TEC-QEE.QMS.team@esa.int

Over their lifetime, materials, components or small assemblies must withstand different environments without decreasing performance or experiencing degradation. In particular, in orbit, parts are subject to many potentially damaging factors, including UV radiation , X-rays, charged particles and orbital debris strikes. Frequent switching from scorching sunlight into bittercold shadow –thermal cycling- must be withstood, while atomic oxygen found at the top of atmosphere is inherently erosive/corrosive.

In some cases the synergistic impact of combined environmental effects has unpredictable consequences. The environmental test laboratory uses unique test facilities to replicate one or more detrimental factors of the space environment, including dedicated facilities for synergistic testing. For long-duration missions lifetime testing may not be practical, so facilities are also set up for accelerated testing to extrapolate results.

The environmental test laboratory has facilities for:

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1.1 Atomic oxygen erosion effects

The atomic oxygen facility, called LEOX (Low Earth Orbit Oxygen), produces a flux of atomic oxygen to evaluate erosion effects on materials

Instruments & technical parameters

Atomic oxygen (AO) produced by dissociation of molecular O2 using pulsed CO2 laser

Beam quality and AO kinetic energy monitored by mass spectrometer

Atomic fluxes: around 1·10²⁰ atoms/cm² per day

Typical AO energy: 5.5 eV

AO beam angle with respect to samples: 0-90

Background pressure during exposure: <10-5 mbar

Dimension of samples: typically 21X21 mm² possibility of adaptation for bigger samples

Sample transfer to XPS or other exposure facility in vacuum

1.2 UV/VUV radiation

UV-VUV testing can be performed on several facilities under high vacuum conditions. UV radiation used ranges from 120 up to 400 nm. Several vacuum facilities can be used such as, CROSS1,CROSS2, CROSS3, BOF and MCROSS facilities

Instruments & technical parameters

Cross facilities (1, 2, 3 and MCROSS)

UV/VUV radiation from 115 nm to 400 nm up to 13 UV Solar Constants Thermal ageing up to +400 C

Extreme thermal cycling from –150 C to +400 C (or higher in some cases) In-situ thermal imaging of samples

Residual gas analysis of gas contamination (mass spectrometer)

Pressure in the range of 10-5 - 5.10-7mBar

Max size of the sample is 200x200 mm. Height is up to 150 mm

Outgassing condensable contamination product monitoring via QCM

Nominal samples size: 19x19 mm²- changeable to fit sample plate dimension 140x160 mm²

Accelerated UV exposure facility (BOF)

UV/VUV radiation from 115 nm to 400 nm up to 20 Solar Constants

Infrared registration of sample temperature –150 C to 500 C (patented 2D IR imaging)

Residual gas analysis of gas contamination (mass spectrometer)

Pressure in the range of 10-5 to 5x10^-7 mbar

Max size of the sample is 200x200 mm. Height is up to 150 mm

1.3 Temperature and humidity

Thermal cycling and thermal ageing of spacecraft materials to extreme temperature and humidity levels is conducted here. Thermal vacuum facilities are based on a high vacuum furnace design attached to a vacuum chamber. Nitrogen purged and atmospheric conditions available. The facility contains a shroud, cooled via liquid nitrogen, with the purpose of condensing possible molecular contaminants released from the hot area of the chamber, where samples can be heated up to 1100 °C. The main purpose is to simulate the thermal ageing of samples up to extreme temperatures.

Instruments & technical parameters

High temperature furnace Entech:

Temperature up to +1600 C

Ambient pressure (air or GN2)

Samples: 10x10 cm² - Height: 100mm

Humidity test chambers:

Humidity: 10-95%

Temperature: -70 °C to 180 °C

Samples: 50x50x50 cm³

1.4 Synergistic Temperature Accelerated Radiation Effects

Synergistic test facilities offer the possibility to expose multiple temperature-controlled samples simultaneously to different radiation sources and to measure in situ thermo optical properties without breaking the vacuum. Radiation sources comprise UV, VUV, protons and electrons. It is also possible to add outgassing contamination sources to the environmental chamber. Facilities such as the STAR1, STAR2 or CROSS-3M are capable of synergistic effects.

Instruments & technical parameters

STAR 1 and STAR II

Intense UV/VUV radiation (115-400 nm) up to 10 solar constants

Particle radiation: Electrons <100keV, Protons 60 keV

Extreme temperatures -180 to +550C (depending on UV intensity)

Vacuum in-situ solar reflectance characterisation (integrating sphere)

Vacuum in-situ Raman spectroscopy measurement

Residual gas analysis using mass spectra up to 500amu

Contact less in-situ temperature sample surface monitoring and regulating using pyrometer and 2D thermo-vision camera techniques

Pressure: (guaranteed vacuum < 10^-6mbar) – typically 10^-8mbar

Sample size: several samples can be tested simultaneously on a regulated temperature plate of 8 x 15 cm²

Dimension of samples: typically 20 x 20 mm² possibility of adaptation for bigger samples

1.4 Synergistic Temperature Accelerated Radiation Effects

Cross 3M

Extreme temperatures –180 C to +550 C

Several in-situ spectroscopic measurement instruments.

Sample plate can operate in temperature range of -150 to +400 °C

Intensities of UV/VUV sources can be tuned to values from 1 to 10 SC. Facility has Knudsen Cell used as the contamination source and several Quartz crystal microbalances (QCM) for measurements of contamination fluxes

1.5 Electron/proton radiation

Compact low energy proton and electron sources are attached to space environmental vacuum facilities in order to simulate space particle irradiation. Both sources can achieve energies up to 100 keV.

Instruments & technical parameters

ESD

Electrons from 5 to 30 keV

Temperature: -240 °C to 25 °C

Sample size: 10 x 10 cm

STAR1/STAR2

Electrons from 30-100 keV

Protons: 60 keV

Temperature: -170 °C to 400 °C

Sample size: 20 x 20 mm

1.6 Electrostatic Discharge

The Electrostatic Discharge effects on spacecraft materials are monitored, with in-situ analysis capabilities of the materials’ (dis)charging behaviour.

The ESD facility offers the possibility to expose samples to a wide range of temperatures (-240°C up to 25 °C), to an electron source and to measure, in – situ, the time evolution of the surface potential.

Instruments & technical parameters

Particle radiation: Electrons up to 30 keV, higher energy level possible upon request (100 keV / 1 meV)

Extreme temperatures –240 C to +25 °C

Contact less in-situ temperature sample surface potential monitoring Pressure: vacuum < 10^-6mbar

Dimension of samples: typically 20X20 cm² possibility of adaptation for bigger samples

Spectral response acquired as a function of the amount of contaminant on a critical/optical surface:

The outgassing source is at a certain (usually high) temperature, while its outgassed species condense on the optical surface which is at the desired testing temperature

Evaluation of contamination’s direct consequences/effects on sensitive optical surfaces

Different optical set-ups available: Normal Reflectance, Total Reflectance, Transmittance, other angular configurations available upon request.

With UV/VUV illumination capabilities, Synergistic effect of contamination deposit under missio nrepresentative environments (pressure, temperature profile, VUV, …) can be achieved

With a modular design, the test chamber is easily adaptable to different sample configurations:

Samples with different shapes and thickness (up to several cm).

Representative flight configurations.

If applicable, off-the-shelf substrates (SiO2, MgF2, mirrors, ...) may be supplied by TEC-QEE according to customer's needs - minimizing lead time for tests.

The acquired spectra enables additional optical characterizations (refractive index,absorption coefficient) of the contamination layer and thus further simulation and modelling capabilities.

1.7 In-situ optical performance evaluation

The λuta (λ Unified Testing Assembly) facility is a vacuum chamber equipped with a spectrometer that is specially designed to evaluate in-situ the performance of sensitive optical surfaces during the controlled deposit of contaminants and assemblies such as mirrors, filters, windows, solar cells and radiator/baffle paints.

Instruments & technical parameters

1.8 Development of space resistant 3D printing materials

Instruments & technical parameters

Material validation and quality assessment for 3D printing of high performance thermoplastic and thermoplastic composites (PEEK, PEKK, ULTEM, SMP etc)

Effect of printing strategy on resistance to space environment

4D printing and shape programming with respect to space environment with high performance thermoplastics

2. CLEANLINESS AND CONTAMINATION CONTROL

Contact: TEC-QEE.QMS.team@esa.int

Space hardware must be kept rigorously clean: any contamination could endanger instrument performance, mission success or astronaut health. Organic materials give off trace chemicals which, in the vacuum of space, can cause molecular deposition and even the thinnest of layers may affect contamination sensitive equipment such as telescope mirrors or laser lenses, solar array or thermal control surfaces. In enclosed pressurised environments , airborne contamination is the concern, as astronauts must not be exposed to toxic substances. Contamination by dust and debris - even sloughed-off skin cells- may cause beam scattering or affect the working of propulsion or mechanical devices. The Material's Physics and Chemistry Laboratory offers expert advice on cleanliness and contamination control, quantifies particulate & molecular contamination levels, audits cleanroom facilities tests materials, flight hardware for their contamination potential and performs bake-outs.

The laboratory is a unique collection of specially-designed facilities.

Facilities:

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2.1 Screening Outgassing Facility (μVCM)

Measurement of the outgassing screening properties of space materials or components based on ECSS-Q-ST-70-02.

Instruments & technical parameters

Micro-VCM material screening outgassing test facility (μVCM)

Quantitative gravimetric measurement

TML - Total Mass Loss

CVCM - Collected Volatile Condensable Material

RML - Recovered Mass Loss

WVR – Water Vapor Regained

Screening Outgassing Facility (μVCM)

Sample Cups

Per sample cups per material are tested
Per test run specimen cups used for reference
Weight range: 100-300 mg

Test validity for materials:

Subjected to operational temperature of 125 °C for a short period of time

Subjected, during the mission, to temperature below 50 °C for an extended period of time (in the order of hours)

Subjected to operational temperatures below 50 °C for an extended period of time (in the order of weeks or above)

2.2 Dynamic Outgassing Facilities

Measurements of the dynamic outgassing properties of materials or components by monitoring mass change as a function of time and temperature. The technique provides mathematical parameters for long term predictions calculations & modelling tools by testing geometrically representative samples in vacuum. VBQC and DOK facilities are based on ECSS-Q-ST-70-52.

Instruments & technical parameters

Quantitative study of the kinetics as a function of temperature

TML - Total Mass Loss

CVCM - Collected Volatile Condensable Material

Acceleration factors

Activation energies

Residence time-temperature dependency

Condensable material collected on QCM’s (Quartz Crystal Microbalances) *ASTM 1559 compatible.

*All systems can be coupled with residual gas analyzers

DOK

Temperature range:

ambient to 450 C

Sample size:

Ø50 mm x 75 mm

Working pressure:

vacuum 10^-7mbar

Resolution:

1 microgram

Range:

QCM needs to be re-evaporated every 100 mg TML

2.3 Bake-out Facility

Facility to perform controlled bake-outs of contamination sensitive hardware for contamination critical missions and payloads.

Instruments & technical parameters

Quantitative study of the organic deposition as a function of temperature and time at isothermal conditions, in vacuum.

TML - Total Mass Loss (ex-situ)

CVCM - Collected Volatile Condensable Material (in-situ)

Pre-defined bake out stopping criteria based on the best effort at an isothermal temperature

Organic material deposition analysis using a QCM at the mission temperature at the end of a bake-out.

Bake out facility

Maximum sample size:

210x300 mm

Temperature range:

ambient to 150 C

Vacuum pressure:

10^-7 mbar

RGA and QCM monitoring possible

2.4 Chemical Contamination Laboratory

For the determination of Molecular Organic Contamination with Fourier Transform Infrared Spectroscopy.

Instruments & technical parameters

FTIR analysis of Molecular Organic Contamination (MOC)

FTIR: Fourier Transform Infrared transmission spectroscopy provides the possibility to determine levels & types of surface MOC, and thus enables to trace back sources of contaminants

Available analysis range: 6500-10 cm^-1

The absolute detection limits for surface contamination are around 0.2 x 10^-7 g/cm²

Multiple surface contamination collection and test techniques in accordance with ECSS-Q-ST-70-05C are available.

FTIR microscopy allows for qualitative determination of surface contaminants by direct surface probing (reflection, transmission, ATR)

Double glass blade aperture allows for easy separation of areas of interest

Fast LN2 cooled MCT detector offers fast analysis runs on multiple surface regions

2.5 Gas Chromatography/Mass Spectroscopy

Three independent GC systems are optimized for variety of analyses on volatile organic compounds, with detection limits as low as ng. One GC/FID system is dedicated to CO2 detection, down to < 1 ppm level. A second GC/MS system analyses VOCs in different types of samples (direct injection of gas, liquid, solid). The third, Automated Thermal Desorption GC/MS, system allows for an automated offgassing toxicity analysis for manned spaceflight cleanliness verification of purging gas systems (ECSS-Q-ST-70-29C). Detection limits of ppbs can be reached.

Instruments & technical parameters

GC/MS: Gas Chromatography/Mass Spectrometry

GC/MS: Gas Chromatography/Mass Spectrometry enables separation of complex component mixtures and acquisition of mass spectrum for each component

Ionization and subsequent fragmentation allow for identification of organic compounds by comparison with established MS libraries

Three independent GC/MS systems are optimized for variety of analyses including liquid injection and thermal desorption

Available limits of detection are as low as a ng

Easy and automated off-gassing toxicity analysis for manned spaceflight (ECSS-Q-ST-70- 29C) is enabled by the use of a multi-sample thermal desorption unit

GC/FID system dedicated to CO2 detection allows for testing CO2 concentrations down to <1 ppm levels

2.6 Particle Contamination Measurements Description

For particulate contamination control several techniques are available, including airborne particle counter, particle fall-out, optical and SEM particle counting, tape-lift measurements and essential cleanliness assessment. More information is available upon request.

Instruments & technical parameters

Airborne particle counter:

Portable particle counter

Flow rate 1ft3/min

ISO Class certification: ISO class 5 - 8

Particle distribution: from 0.3 to 20 μm

Temperature and relative humidity monitoring

Example: Class ISO 8 Maximum concentration limit per litre of air is Particles >0.5 μm: 3520 and Particles >5 μm: 29

Particle Contamination Measurements Description

Particle Fall Out (PFO) meter:

PFO sample plates exposed in the vicinity of flight hardware

PFO meter measures collected contamination and results are expressed in ppm (particle per million)

Resolution: +/- 1 ppm

Example: Class ISO 8 maximum 275 ppm/24 hours

Optical particle counting:

Automatic particle counting with shape and size

Minimum size of the particles: 5 μm

SEM/EDX particle counting:

Automatic particle counting with shape and size

Elemental composition (EDX)

Minimum size of the particles: 100 nm

3. EEE COMPONENTS

Contact: EEELab@esa.int

The Materials and Electrical Components Laboratory maintains numerous facilities to carry out various analyses and tests to ensure reliable EEE Components (Electrical, Electronic and Electro-mechanical) on ESA missions and external projects. From the smallest passive EEE part to the most complex integrated circuit, the laboratory offers an outstanding testing capability. Recently, new capabilities for battery analysis have been added to the portfolio. The laboratory offers services in the areas of:

Failure Analysis
Destructive Physical Analysis
Reliability Analysis
Radiation Effect Characterisation

The laboratory focuses on tasks that are non-routine, are ESA project schedule critical, require independent and impartial support, and require specific confidentiality constraints.

The following facilities are employed to assess EEE Component reliability:

Facilities

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3.1 Scanning Electron Microscopy and Focused Ion Beam Facility: nano-scale investigation of semiconductor devices.

Scanning Electron Microscopes and Focused Ion Beams are employed to expose manufacturing processes of EEE components.

The latest technologies are frequently investigated in the ESA components laboratory, not only to identify suitability for flight on ESA missions but also to assist in their development by European manufacturers.

Description, Instruments & technical parameters

State-of-the-art Scanning Electron Microscopes (SEMs), Plasma Focused Ion Beam (PFIB) & DualBeam FIB/SEM systems are employed to examine the finer details of these novel technologies with sub-nanometer imaging resolution (depending on SEM detectors, sample preparation, and mode of operation). The instruments are equipped with an additional micromanipulator for sample lift-out, and with Pt and carbon GISs for deposition, and XeF2, iodine & Delineation Etch GISs for etching, providing a complete range of options for sample preparation.

Additionally, several in-situ SEMs characterization techniques are available, including scanning transmission electron microscopy (STEM), energy-dispersive X-ray spectroscopy (EDX), wavelength-dispersive spectroscopy (WDX), and electron beam induced current (EBIC).

3.2 X-RAY Tomography and Optical Microscopy Facility: X-Ray Tomography is a crucial element of failure analysis tasks, to non-destructively identify failure sites.

The Optical Microscopy Facility boasts a variety of optical microscopes, covering a wide range of magnifications and illumination techniques. A core equipment for EEE component failure analysis, the X-ray tomography machines are high performance equipment capable of uncovering fine details of internal EEE component structures. These instruments capture over 1000 2D X-ray images of an object, using powerful computers to reconstruct a 3D model. This model can then be virtually micro sectioned and inspected.

DESCRIPTION, INSTRUMENTS & TECHNICAL PARAMETERS

Low magnification stereomicroscopes and high magnification microscopes up to nominal 2500x magnification power.

Two X-Ray inspection instruments:

The largest instrument equipped with two x-ray sources: a 180kV x-ray tube for high resolution inspection of small low density samples, and a 300kV x-ray tube for inspecting larger, higher density samples.
The second instrument, equipped with a 140 KV x-ray tube, is configured to also be used for high quality 2D X-ray sample investigation.

3.3 Environmental Test Facility

To simulate the demanding storage, launch and operational environments experienced by EEE components flown on ESA missions, a combination of highly specialized equipment is available to assess EEE component tolerance to mechanical and climatic stresses under tightly controlled conditions.

Description, Instruments & technical parameters

Available Equipment Includes:

Climatic Chambers (-70°C to +180°C, 15°C/min, 10% to 95% R.H.)
Shock Test Tower (500g@1ms, 1500g@0.5ms, and 3000g@0.3ms)
Shaker (2700N sine, 2000N rms)

3.4 Electrical Measurement Facility

The electrical measurement facility maintains a large pool of equipment useful for simplifying and reducing time for measurement tasks, covering testing from DC to RF/MW. The facility is currently used mainly in support of total ionising dose irradiation test campaigns and during failure analyses.

Description, instruments & technical parameters

RF/MW component testing, including:

RF component measurements: oscilloscopes, spectrum analysers, Vector Network Analysers (up to 67GHz)
Probe station with automatic measurements at room temperature
16-channel fully automatic life testing, at high and low temperatures, for L- and S-bands

3.4 Electrical Measurement Facility

DC testing, including:

Automated Test Equipment (ATE) for electrical measurement of a broad range of electronic components and electrical parametersters

Semiconductor Parameter Analyzer for full electrical characterisation

Electrical measurements at room, high and low temperatures ( -70°C to +300°C)

Precision DC parametric test

Electrostatic discharge (ESD) test

Burn-in, static and dynamic life tests

3.5 - Radiation Test Facilities

Contact : ERFbooking@esa.int

3.5.1 – Co60 Facility

State-of-the-art facility for Total Ionising Dose tests on EEE parts and materials with photons emitted by a Co60 source. Consists of a spacious control room and a large radiation cell with 14 cable feed-through for monitoring and control of complex experiments. The facility is capable of providing end-to-end turnkey irradiation test solutions to ESA space projects and activities. If you need a TID test please follow this link.

Instruments & technical parameters

80 TBq Co60 source for Total Ionising Dose tests
Dose rate window compliant with the ESCC22900 standard (from 0.01 rad/s [Si] to 3rad/s [Si] ) with the possibility to change dose rate during irradiation.
ISO/IEC 17025 accredited dosimetry.
Automated total dose and dose rate monitoring and logging
Automated DC power distribution and logging in the irradiation cell
Advanced electronic measuring equipment for EEE parts characterisation.
Possibility to perform low temperature irradiation tests
Remote control of DUT setup positioning

3.5 - Radiation Test Facilities

3.5.2 – PULSYS Rad by PULSCAN

Preparation for Single-Event Effects
Design debugging
Defect localisation,
Reliability evaluation,
Part screening and qualification

Instruments & technical parameters

Two different configurations:

1. SPA (Single Photon Absorption) for surface injection

Laser wavelength: 1064nm
Pulse duration: 30ps
Max pulse energy at fibre output: 50nJ

2. TPA (Two Photon Absorption) for a localised injection

Laser wavelength: 1550nm
Pulse duration: 450fs
Max pulse energy at fibre output: 30nJ
Bottom of the lab page

3.5 - Radiation Test Facilities

3.5.3 - CASE (Californium-252 Assessment of Single-event Effects)

The CASE facility offers a low cost approach to simulate SEE tests on semiconductors using a Cf-252 source, often employed as a test set-up verification method prior to testing at heavy ion facilities. If you need a TID test please follow this link.

Main parameters of the CASE facility

Radiation source

Cf-252

Spontaneous fission particle with average Linear Energy Transfer of the fission product (LET)

43 MeV/(mg/cm²)

Sample preparation for Single Event Effects tests

Contact : ERFbooking@esa.int

Decapping, delidding, or backside thinning of EEE for Single Event Effects tests with heavy ions for a direct exposure of the die to the particles.

Instruments & technical parameters

Sample preparation is carried out by chemical etching of the covering, laser evaporation of the covering, plasma etching or mechanical removal of the cover using a milling machine.

4. PHYSICO – CHEMICAL ANALYTICAL SERVICES

Contact: TEC-QEE.QMS.team@esa.int

The laboratory has a unique collection of state-of-the-art analytical measurement equipment to evaluate the physical, chemical and surface properties of test items: From thermo-optical characterization (emittance, reflectance, absorptance), to determination of molecular and lattice structure, passing through an exhaustive study of surfaces and topologies, and other material properties.

Measurement equipment:

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4.1 Thermo-Optical properties Characterization techniques:

Photospectroscopy:

Portable Thermo-Optical Device – Optical investigation of materials at ambient temperatures across UV-VIS-NIR-IR wavelengths.

Main Parameters

Thermo-Optical Measurements according to ECSS, allowing the characterization of thermal emittance and solar absorptance. Several instrumentation available: Portable devices (allowing external measurements at customer's premises) as well as benchtop UV/Vis/NIR spectrometers and IR vacuum spectrometers.
Optical characterizations of samples in the UV-Vis-NIR-IR bands in several configurations (total transmittance/reflectance, scatter measurements, angular dependent response, specular measurements, ...)
Capabilities to cool-down or warm-up samples available.
Optical characterizations of thin films and coatings using imaging ellipsometry at microscopic level (characterization of optical properties and thickness of anomalous layers).
Raman spectroscopy: Fast and localised analysis of chemical structure, phase and polymorphy, crystallinity and molecular interactions. Sensitivity of less than one monolayer, can identify substances and/or defect regions.
Optical and Laser microscopy.

4.2 Thermo-Optical properties Characterization techniques:

Photospectroscopy:

Main Parameters

Confocal microscopy: 3D measurement that allows a much more efficient (when compared to traditional 2D microscopy) and precise way to characterize a surface (e.g. surface topography)
X-ray Photoelectron Spectroscopy: chemical information about the top 5nm, identifying substances and characterizing materials and affected regions.
Atomic Force Microscopy, Surface profiling, allowing atomic scale 3D image of surfaces down to 0.1nm
Contact Angle System: Measurement of surface free energy of the interface between solid/liquid
Scanning Electron Microscopy: Revealing fine surface detail and coupled with Energy Dispersive Spectroscopy of X-rays (EDX) and Wavelength Dispersive X-ray Spectroscopy (WDX) to map and quantify elemental distribution
Other equipment employed in electrical component reliability analysis: Bond pull tester, die shear, Particle Impact Noise Detection (PIND), shock, vibration, constant acceleration, gross and fine leak tester, test chambers for temperature cycling, humidity, endurance testing.

4.3 Optical & laser microscopy

The Optical Microscopy Facility boasts a variety of optical microscopes: low magnification, high magnification, digital, confocal microscope. Several microscopes are available with resolution as low as 2 nm.

Instruments & technical parameters

Important features:

Low magnification stereomicroscope up to nominal 150x magnification power
High magnification microscope up to nominal 1500x magnification power
Z-Stack and Mosaic reconstruction
Brightfield, Darkfield, Polarized or Differential Interference contrast Illumination
Digital microscope for image documentation or uneven surface investigations
Confocal Microscopy
The 3D Confocal Microscope (compared to the traditionally used 2D equipment) allows the instrument to be used in a much more efficient and precise way for performing surface coating analysis and surface topography. 3D optical surface metrology system combines confocal and interferometry for high speed and high resolution measurements down to 0.1 nm.
Optical Microscope Cooling and heating stage (-100 to +600C)
Light/ Illumination Control

4.4 Raman microscopy

Fast and localised chemical analyses of samples with chemical concentrations less than one monolayer to identify substances or defect regions

Instruments & technical parameters

Express and localised chemical analyses of samples with surface concentration of substances less than one monolayer.
Spectroscopic mapping based on Raman and luminescence signals from samples on areas up to several square centimeters with spatial lateral resolution down to 1 μm
Detecting locations of components or regions of defects by the high intensity areas in spectroscopic maps and the chemometrics pattern recognition
Identification of substances and chemical imaging of samples based on their Raman signatures

4.5 X-ray Photoelectron Spectroscopy, Atomic Force Microscopy & surface profiling

Instruments & technical parameters

XPS provides information about chemical composition of the top 12 nm of a sample surface

Monochromatic X-ray source with an excitation energy of 1486.7.eV in a narrow band of 0.25 eV
Energy resolution down to 350.meV
Measuring of conductive and non-conductive materials
Composition, depth profiling and interface analysis

4.5 X-ray Photoelectron Spectroscopy, Atomic Force Microscopy & surface profiling

X-RAY Diffraction, X-RAY Fluorescence and X-RAY topography spectroscopies

Phase analysis
Degree of crystalline
Detection of lattice strain differences
Residual stresses measurements

PhoenixV/tomeX-ray–microfocus XRTinstrument

Scanning Laser Acoustic Microscopy (SLAM)
Scanning Acoustic Microscopy (SAM)
Computer Tomography

4.6 Contact Angle System

Measurement of various substrates and surface free energy of liquids

Instruments & technical parameters

High speed camera/ image acquisition 25 fps (up to 50 fps half resolution)
Drop volumes of microliters (polar/non-polar liquids)
X, Y and Z -axis stage movement
Single/multi dosing syringe dosing droplet software system
Automatic/manual drop shape analysis software
Vacuum chuck accessory for thin film contact angle measurements
Temperature/Peltier humidity controlled chamber options
Sample size: up to 100x100 mm² (for solids)

4.7 Surface Analysis – Scanning Electron Microscopy

Revealing fine surface detail and coupled with Energy Dispersive Spectroscopy of X-rays (EDX) and Wavelength Dispersive X-ray Spectroscopy (WDX) to map and quantify elemental distribution

The Scanning Electron Microscope allows for detailed analysis of surfaces at high- magnification including elemental and crystallographic analysis. This is a valuable instrument which can aid in non-destructive inspection, failure analysis and research and development

Instruments & technical parameters

Scanning Electron Microscopy (SEM) + EDX and EBSD Analysis
Imaging of conductive and non-conductive materials
High magnification fractographic examination to determine the cause of failure or damage to a component, including overload, fatigue and stress corrosion cracking
High resolution elemental information is available with EDX
Grain morphology and orientation information is available with EBSD
Particle counting and elemental quantitative/qualitative analysis available
Raman in-situ measurement capability: spatial resolution 1 μm, depth profile resolution 2 μm
High resolution imaging of samples to 1 nm at 30 kV

4.8 Confocal Microscopy

The 3D Confocal Microscope (compared to the traditionally used 2D equipment) allows the instrument to be used in a much more efficient and precise way for performing surface coating analysis and surface topography. 3D optical surface metrology system combines confocal and interferometry for high speed and high resolution measurements down to 0.1 nm

Main Parameters:

3D profile by laser confocal measurement of violet semiconductor laser at 404 nm
Large sample accomodates samples up to 100 mm x 100 mm
Height resolution of 0.5 nm, width resolution 1 nm
Data analysis and treatment allowing volume/area measurements, step height measurement, surface roughness, line roughness, profile measurement, batch analysis/comparison, etc.

4.9 - Hardness measurements.

Shore A and micro-IRHD hardness values of rubbers, silicones and elastomers can be measured in ambient conditions with calibrated instruments. These quick measurements are an efficient quality control for soft materials.

4.10 Non-destructive testing

X-RAY COMPUTED TOMOGRAPHY

X-ray Computed Tomography (CT) allows materials and EEE components to be imaged and analyzed in a completely non-destructive manner, revealing fine details of internal structures.

Computed Tomography capabilities:

Failure analysis
Internal defect analysis
Inclusion characterization
Production quality verification
Weld porosity measurement
Complete mapping of entire parts
Feature identification and measurement
Extraneous matter localization inside a component

Important features:

Captures over 1000 2D x-ray images of objects, using powerful computers to reconstruct a 3D model of the component. This model can be then virtually cross- sectioned
Two X-ray sources:
Up to 180kV nominal voltage, for high resolution imaging, low density samples
Up to 300kV nominal voltage, for tomographic imaging, higher density samples
Detector up to 30 frames per second.
High quality 2D X-ray sample investigation

4.10 Non-destructive testing

X-ray Diffraction

X-ray Diffraction (XRD) gives insight not only into the structure of solid- state samples, but also into other properties such as residual stresses and structural changes due to phase transitions.

Main Features:

Completely non-destructive
Cu/Cr X-ray sources
1D/2D detectors
Temperature chamber (-150 to +450°C, vacuum 0.9-1.3 mbar)
Accommodates wide range of sample types and geometries, from powders to propulsion tanks

Qualitative and Quantitative Analysis:

Material identification/confirmation
Phase analysis, lattice parameters
Structural phase transitions
Degree of crystallinity
Mean crystallite size, texture effects
Detection of lattice strain differences
Residual stress measurements
Characterization of coatings

4.10 Non-destructive testing

X-ray Fluorescence (XRF)

X-ray Fluorescence (XRF) provides compositional information about a sample in a non-destructive manner without the need for sample preparation.

X-ray Fluorescence Capabilities:

Completely non-destructive
Minimal or no sample preparation required
Diverse sample types (inhomogeneous and irregular shapes) can be inspected
Coating thickness measurement
Portable equipment allows in-situ inspection

Important Features:

W (Tungsten) and Rh (Rhodium) targets
Point analysis as small as 25 μm
Large area mosaic scan ability
Can be performed in vacuum, allowing improved identification of light element composition

4.10 Non-destructive testing

Acoustic micro imaging

Acoustic micro imaging can detect internal defects and evaluate bond quality in many types of materials. This testing equipment is non-destructive and suitable for use in a variety of applications:

Scanning Acoustic Microscopy (C-Sam) capabilities:

Material characterization
Failure analysis
Process development
Detection of delamination in composites
Braze joint examination

Important Features:

Visualization of delamination or de-bonding of internal surfaces
Detection of voids or defects within samples

4.11 Corrosion testing

Components may experience aggressive environments prior to, and in flight. Understanding the susceptibility of materials to various types of corrosion in harsh environments can be tested using a variety of equipment.

General Corrosion Behaviour

The neutral salt spray test can be used to quickly determine the corrosion resistance of materials and coatings under accelerated conditions
Cyclic immersion testing can be used to determine the general corrosion behavior of a material

Stress Corrosion Cracking (SCC)

The susceptibility of materials to corrosion while exposed to an aggressive environment under tension can be assessed using various fixtures and test methods
Samples are exposed to salt bath or propellant environment
Tested according to ECSS-Q-ST-70-37C (performed at external laboratory)

Red Plague Corrosion

Red Plague Corrosion can occur when wiring is not adequately silver plated, resulting in electrical failures during mission lifetime
Susceptibility of wires to this type of corrosion can be assessed by testing according to ECSS-Q-ST-70-20C

5. THERMAL ANALYSIS LABORATORY

Contact: TEC-QEE.QMS.team@esa.int

The thermal analysis laboratory in ESTEC has an exhaustive collection of instruments suited to characterize physical and chemical properties of samples at material level in a wide range of temperatures. From the well-known TGA and DSC techniques, commonly used to determine degradation and transition temperatures, curing levels or other possible chemical effects, to more dedicated techniques such as the rheometer which we use, amongst others, to characterize dynamic moduli under different temperature and humidity levels of viscous and solid samples. Furthermore, physical properties such as coefficient of thermal expansion, thermal conductivity and diffusivity, or electrical conductivity can be measured at sample level, providing useful values to modelling suites.

Measurements and analysis

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5.1 CTE measurements of samples

The coefficient of thermal expansion can be measured on temperatures between -170°C up to 1500°C with several mechanical or laser techniques, under vacuum or inert atmosphere.

TMA – Thermo Mechanical Analysis:

Temperature range:

[-170,+1000] °C and [RT,+1500 C] °C under N2 atmosphere, air or vacuum

Sample dimensions:

Samples must have two parallel flat surfaces in the measurement direction. For TMA, samples should have dimensions up to 8 x 8 x 8 mm³. For vertical Laser Dilatometery, it should be a cylinder or parallelepiped with 20 mm height and around 6 - 8 mm diameter. For horizontal Mechanical Dilatometer, samples can have length of 25 mm or 50 mm, with diameter of around 8 mm.

Force:

0.01 to 1 N

5.2 Thermo Gravimetric analysis

The evolution of sample mass as a function of time and temperature is measured under air or inert atmosphere. Advanced Model Free Kinetics can be used to predict the degradation of materials in long timescales.

Temperature range:

[25, 1600] C

Heating rate range:

0.1 K/min up to 3000 K/min (ballistic)

Sample dimensions:

Typically in the order of few tens of mg. Other dimensions possible.

Environments:

Air, N2, Ar, vacuum

Additional options:

TGA/DSC measurements possible

5.3 Differential Scanning Calorimetry

DSC instruments are used to measure (glass) transition temperatures, melting points, and to determine the cure degree of adhesives when following/simulating a specific curing profile. Together with TGA, it is one of the most commonly used thermal analysis techniques due to the quick and accurate results.

Temperature range:

[-150, 500] °C

Sample dimensions:

typically in the order of few tens of mg. Other dimensions possible. Multiple crucible materials available

Environments:

Air, N2, Ar

Additional options:

Temperature modulated DSC

5.4 Rheology and Dynamic Mechanical Analysis

Two dynamic mechanical analysers are available to measure storage and loss moduli, and derive tan delta of all types of materials under shear, compression, tension or 3-point bending modes in a wide range of frequencies and temperatures.

Time-Temperature Superposition technique is also applied to derive the physical properties at frequency or temperature ranges that cannot physically be achieved in the instrument.

Moreover, a hybrid rheometer measures viscosity of liquids such as lubricants or uncured adhesives, and allows us to follow the shrinkage of an adhesive while curing, or under a temperature exposure. Viscoelastic properties can also be measued in shear or tension, under different relative humidity values and temperatures.

It also has a tribology accessory to determine the coefficient of friction of two materials under – or without – lubrication.

5.4 Rheology and Dynamic Mechanical Analysis

Rheometer: angular displacement (strain) on application of torque (stress), torque (stress) on application of angular displacement (strain).

Magnetic bearing

Peltier and ETC chamber for temperature ranges between [160, 600] °C

Disposable plates with diameters: 8, 25 or 40 mm

Torque range 2 nN·m - 200 mN·m

Camera included

DMA: Dynamic Mechanical Analysis

Mechanical properties of viscoelastic materials as a function of time, temperature and frequency.

Option of DMA1: modular humidity generator system for environmental and long term storage analysis campaign

T range:

[-180, 600] ⁰C

Frequency range:

[0.001, 1000*] Hz

Force range:

[0.1, 40] N

Measuring modes:

3-point bending, shear, tension, compression

Advanced techniques:

TTS

5.5 Thermal properties measurement

Laser Flash Apparatus and Hot Disc measurement use different heat-inducing techniques in order to measure or derive the thermal conductivity and thermal diffusivity of a material. Created for small samples, LFA can be used in vacuum, air or inert gas, from -150°C up to 1100°C.

Laser Flash Apparatus (LFA): Measures the thermal response of a material to an incident laser under a temperature program

Temperature range:

[-150, 500] ⁰C, [RT, 1100] ⁰C

Sample dimensions: thickness range:

[ 0.05, 5] mm, diameter range: [6, 25.4] mm

Working pressure:

Ambient and vacuum at 10E-2 mbar

Diffusivity range:

[0.01, 1200] mm²/s

Hot Disc: Measures the thermal response of a sample to an electrical heat pulse

Sample Dimensions:

Min 0.5 mm thick (slab mode), 5 mm diameter

Large samples

Preferred (10 x 10 cm2)

Diffusivity range:

[0.1, 1200] mm2/s

Conductivity range:

[0.005, 1800] W/mK

5.6 Broadband dielectric spectrometry

Optimized for low loss dielectric materials, BDS measures complex impedance and calculates dielectric parameters as complex permittivity and complex conductivity in a frequency range from 3 µHz to 3 GHz

Electrical resistivity- 4 point probe technique 4 point probe:

Resistivity measurement range: 0-1000 ohm/square

Surface and bulk resistivity following ASTM D257

Bulk (volume) resistivity

10+3 - 10+18 ohm.m

Surface resistivity

10+3-10+17 ohm

Sample size

90 x 90 mm2 with maximum thickness of 1 mm

6. FACILITY PROTOTYPING

The Materials and Electrical Components Laboratory has the capabilities to construct prototype facilities in short timeframes, in response to project needs for rapid failure analysis and urgent investigations

We have experts in a wide range of disciplines, including :

Vacuum engineering
Facility design and manufacture
Measurement and test techniques
In-situ monitoring (optical, contamination, spectroscopy)
Optical detection and measurement (UV, VIS, IR)
UV light sources and intensity measurement
High temperature test facilities
Thermal control
Contamination monitoring

We work closely with ESTEC infrastructure and the internal workshops, together with local suppliers. Facilities can be constructed on a modular basis, with a wide range of auxiliary hardware available, including :

Vacuum equipment
Thermal baths
IR and optical cameras
Quartz microbalances
Temperature control equipment
Sample plates
Optical windows
Electrical measurement

7. Materials and Processes

The laboratory has a wide variety of materials characterisation equipment, connecting in many cases microscopic characteristics to macroscopic properties.

equipment

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7.1 X-ray Inspection

X-ray Diffraction can be used for a variety of non-destructive analyses including phase analysis, degree of crystallinity, residual stress measurement and texture measurements.

These measurements can be performed at ambient and non-ambient conditions (-150 to +450°C or vacuum 0.9-1.3 mbar).

X-ray Fluorescence can be used for compositional analysis both in-situ with a handheld instrument or using spot sizes down to 25 µm. Large area mosaic scans and coating thickness measurements can also be performed.

X-ray Diffraction (XRD)

Gives insight not only into the structure of solid- state samples, but also into other properties such as residual stresses and structural changes due to phase transitions.

Main Features:

Completely non-destructive
Cu/Cr X-ray sources
1D/2D detectors
Temperature chamber (-150 to +450°C, vacuum 0.9-1.3 mbar)
Accommodates wide range of sample types and geometries, from powders to propulsion tanks

7.1 X-ray Inspection

Qualitative and Quantitative Analysis:

Material identification/confirmation
Phase analysis, lattice parameters
Structural phase transitions
Degree of crystallinity
Mean crystallite size, texture effects
Detection of lattice strain differences
Residual stress measurements
Characterization of coatings

7.1 X-ray Inspection

X-ray Fluorescence (XRF)

Provides compositional information about a sample in a non-destructive manner without the need for sample preparation.

Capabilities:

Completely non-destructive
Minimal or no sample preparation required
Diverse sample types (inhomogeneous and irregular shapes) can be inspected
Coating thickness measurement
Portable equipment allows in-situ inspection

Important Features:

W (Tungsten) and Rh (Rhodium) targets
Point analysis as small as 25 μm
Large area mosaic scan ability
Can be performed in vacuum, allowing improved identification of light element composition

7.2 ACOUSTIC MICROSCOPY

Acoustic microscopy can be used to non-destructively detect internal and interfacial defects in many material types. This is particularly useful in the case of failure analysis.

Scanning Acoustic Microscopy (C-Sam) capabilities:

Material characterization
Failure analysis
Process development
Detection of delamination in composites
Braze joint examination

Important Features:

Visualization of delamination or de-bonding of internal surfaces
Detection of voids or defects within samples

7.3 Corrosion Testing

Environmental susceptibility of materials can be evaluated in corrosion environments using salt spray testing, stress corrosion cracking testing and red plague testing, all according to relevant ASTM or ECSS standards. Long-term corrosion can also be evaluated in a marine environment near a launch site in Korou, French Guiana.

General Corrosion Behaviour

The neutral salt spray test can be used to quickly determine the corrosion resistance of materials and coatings under accelerated conditions
Cyclic immersion testing can be used to determine the general corrosion behavior of a material

Stress Corrosion Cracking (SCC)

The susceptibility of materials to corrosion while exposed to an aggressive environment under tension can be assessed using various fixtures and test methods
Samples are exposed to salt bath or propellant environment
Tested according to ECSS-Q-ST-70-37C (performed at external laboratory)

Red Plague Corrosion

Red Plague Corrosion can occur when wiring is not adequately silver plated, resulting in electrical failures during mission lifetime
Susceptibility of wires to this type of corrosion can be assessed by testing according to ECSS-Q-ST-70-20C

7.4 Printed Circuit Board (PCB) Qualification/Testing

PCB qualification includes testing according to ECSS standards, inspection and analysis of metallization and dielectric integrity, failure mode investigation and accelerated environmental testing according to mission profile.

PCB QUALIFICATION EQUIPMENT

Standard metallurgical techniques: Microsectioning, microscopy, SEM-EDX, FIB, XRF
Interconnect Stress Testing and DELAM for integrity of metallisation and dielectric
Insulation resistance testing to evaluate electromigration
Infrared Thermography to detect cracks or shorts
Thermal cycling and humidity chambers
X-ray Computed Tomography – non-destructive analysis
Thermal Analysis: TGA, DSC, TMA, DMA
Solderability, wetting balance, thermal shock, rework simulation, vapour phase
Outgassing

PCB Qualification Capabilities

Conformance and qualification testing according to ECSS standards
Inspection and analysis of metallization and dielectric integrity
Failure mode investigation
Accelerated environmental testing according to mission profile

7.5 Electronic Assembly Verification

Capabilities covering inspection and verification of surface mounted device manufacture include metallurgical assessment according to ECSS standards, optical inspection and thermal cycling.

IMPORTANT CAPABILITIES

Environmental testing (thermal cycling)
Coordination of vibration testing
Metallurgical assessment according to ECSS standards
Verification of manufacturers capabilities and soldering processes

Managing of ESA Skills training schools for certification of:

Operators
Inspectors
Instructors

7.6 Mechanical Testing

Mechanical testing includes static, dynamic and torsional tests, up to 250 kN (static, dynamic) and 500 Nm (torsion). A full complement of test fixtures covering a wide range of test types are available, including but not limited to testing of metals, polymers, ceramics, composites and films/foils. Testing can consist of tensile, compression, bending, and custom configurations as well.

Complementing mechanical testing is a suite of optical strain equipment which is portable and can be used on or off-site for a variety of test types, covering volumes from 20 mm3 to several meters cubed.

MECHANICAL TESTING EQUIPMENT

Static (Tensile, Compression, Bending, Torsion) configurations
Dynamic (Fatigue, Crack growth) configurations
Fracture mechanics testing
Integrated thermal chamber
Integrated laser extensometer
Can be used in conjunction with optical strain equipment (ARAMIS/PONTOS)

MECHANICAL TESTING CAPABILITIES

Loads from 1 N to 100 kN
Sample Cooling/Heating (-120°C to +500°C)
Coating integrity testing
3 or 4-point bending
Simultaneous multi-channel data logging (strain gauges, thermocouples, load cells)

7.6 Mechanical Testing

3D OPTICAL STRAIN MEASUREMENTS

Sample geometry changes can be monitored directly to provide displacement and strain measurements. Optical strain measurement is a versatile tool which can be used in many testing applications.

ARAMIS/PONTOS 3D STRAIN MEASUREMENTS

Non-contact optical 3D deformation measurement system
Strain computation and visualisation
Deformation can be measured from 0.01% up to several 100%.
In-situ out-of-plane measurements (buckling, bending, torsion)
Useful for finite-element simulation verification
Reliable measurement of fundamental material properties
For the first time displacements/forces have been measured in-situ on the wheels of the VEGA Mobile Gantry

3D STRAIN MEASUREMENT EQUIPMENT

Standard and high-speed camera systems
Can be used in conjunction with data acquisition system (MGC Plus)
Advanced software tools for data analysis
Can be used with a wide range of standard mechanical testing equipment or custom tests

7.7 Magnetic Material Characterization

Capable of understanding the degradation of magnetic properties due to humidity/high temperature exposure. Magnetic characterization of standard and new magnetic materials can also be performed. Measurements of properties of hard magnetic materials, Remanence Br, coercivity HcB, HcJ, max energy product BHmax, Hknee and recoil permeability (μ recoil).

HYSTERESISGRAPH MEASUREMENT CAPABILITIES:

Measurement of properties of hard magnetic materials, such as Alnico, Ferrite, NdFeB, SmCo and bonded magnets
Remanence Br, coercivity HcB, HcJ, max energy product BHmax, Hknee and recoil permeability (μ recoil)
Automatic measurement of 1st and 2nd quadrant, complete hysteresis loop, recoil line

MAGNETIZER CAPABILITIES:

Ability to magnetize and demagnetize with a wide range of capacitance and voltage (adjustable pulse width)

IMPORTANT FEATURES:

Heated pole caps enable measurements up to 220°C

NDI MEASUREMENT CAPABILITIES FOR MAGNETIC FEATURES

Helmholtz coils provide an easy and non-destructive way to control the quality of permanent magnets

7.8 - Scanning Electron Microscopy (SEM)

In addition to the baseline Scanning Electron Microscopy imaging (Secondary electron, backscatter) and Elemental Analysis with Energy Dispersive X-ray Spectroscopy (EDX) an SEM is equipped with an Electron Backscatter Diffraction detector, allowing mapping of phases and crystals within a material. This is very useful for grain size and orientation mapping of new materials, additively manufactured materials and welds.

SERVICES

Testing

Vibration
Shock
Performance evaluation
Life testing
Environmental Testing
Anomaly investigations
Characterisation
Radiation testing
Cleanliness/contamination control
PCB technology and electronic assembly verification

Measurements

Dosimetry
Prototyping
Advanced metrology
Materials physical and chemical characterisation, materials properties measurements in space simulated env., outgassing, vapour pressure, microscopy, spectrometry, gas chromatography
Contactless strain measurements, X-ray internal defect measurements, 3D surface scanning

Technical expertise

Consultancy
Training
Ad hoc auditing
Development of Space Standards
Cleanroom inspections

Analysis

Thermal-mechanical analysis for materials, failure analysis, vepour pressure, outgassing, spectroscopic analysis
Failure Analysis, fractography, generation of experimental data for static, dynamic mechanical, and thermal analysis